The company has long been engaged in the diamond ultra-thin cutting piece of research, application and development of. Especially in semiconductor packaging materials, glass, quartz, crystal, ceramic and other hard brittle materials cutting processing, has been at or above the level of similar products abroad, gradually replace the imported products, for customers to participate in international competition provides a powerful guarantee.

Main products:

This thin king kong is cut, matrix type diamond cutting, high precision diamond grinding wheel, high precision of diamond cutting/alien grinding wheel