The company devotes for a long time to the research, application and development of high precision and ultra-thin diamond cutting piece. Especially in the aspect of grooving and cutting precious materials such as semiconductor packaging materials, glass, quartz, silcon wafer, compound wafer ( gallium arsenide, gallium phosphide), crystal, ceramic. and so on , it has achieved the overseas advanced level and even substituted for the imported production. It provides powerful support to strengthen customers' competition in the international trade.